NM-SB50A Flip Chip Bonder

PANASONIC

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  • OEM Part Number : NM-SB50A
  • Quantity : 2 EA
  • Condition : Used

Panasonic NM-SB50A Flip Chip Bonder , , •APPLICABLE SUBSTRATE SIZE : 50 mm square to 330 x 250 mm , •APPLICABLE IC SIZE : 1 mm square to 20 mm square , •DRY CYCLE TIME : 1.8s/IC , •BONDING ACCURACY : 3 μm/3 , •IC SUPPLY METHOD Wafer supply : Up to 300 mm (12 inch) diameter •Tray supply : 2 inch square, 4 inch square , •BONDING PRESSURE : 5 N~ 490 N , •BONDING HEAD TEMPERATURE : up to 500° C

1. Shipping

We'll be able to shipment by worldwide. We will ship your order within 2-3 business days.
It will usually takes 5-7 business days after shipment.
All costs include carriage, customs duties & taxes pertaining to the delivery shall be borne by the buyer.
Prior to any shipping, the buyer shall provide

  • Its full details (company name, delivery address, name of contact at said address, telephone number, etc…)
  • As needed, all contact details (company name, account number, delivery instructions, etc…) of the carrier if the client wishes to use his usual provider.
  • FedEx, UPS, DHL, EMS Available

2. Payment detail

Bank Wire Payment
  • Bank Name : Shinhan Bank / Suwon Middle Market Banking Center
  • Address : 2nd Fl, Hyundai bldg., 1018 Ingye Dong, Paldal-gu, Suwon-si, Kyunggi-do, Korea (443-280)
  • Swift Code : SHBKKRSEXXX
  • Account number : 180-002-876309
  • Beneficiary : SYSTA Co., Ltd.
PayPal Payment
  • PayPal Account : judy@systa.kr

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