NM-SB50A Flip Chip Bonder
PANASONIC
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- OEM Part Number : NM-SB50A
- Quantity : 2 EA
- Condition : Used
Panasonic NM-SB50A Flip Chip Bonder , , •APPLICABLE SUBSTRATE SIZE : 50 mm square to 330 x 250 mm , •APPLICABLE IC SIZE : 1 mm square to 20 mm square , •DRY CYCLE TIME : 1.8s/IC , •BONDING ACCURACY : 3 μm/3 , •IC SUPPLY METHOD Wafer supply : Up to 300 mm (12 inch) diameter •Tray supply : 2 inch square, 4 inch square , •BONDING PRESSURE : 5 N~ 490 N , •BONDING HEAD TEMPERATURE : up to 500° C